Skip to main content

NXP Delivers V2X Chipset for Mass-Production Secure Connected Cars

NXP Semiconductors RoadLINK V2X chipsets – for Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) communication – will be put into highvolume manufacturing for Delphi Automotive. Having secured a partnership with a leading global automaker, Delphi’s platform is expected to be first to market and on the roads in as little as two years.
June 3, 2015 Read time: 2 mins

566 NXP Semiconductors RoadLINK V2X chipsets – for Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) communication – will be put into highvolume manufacturing for 7207 Delphi Automotive. Having secured a partnership with a leading global automaker, Delphi’s platform is expected to be first to market and on the roads in as little as two years.

The wireless technology significantly improves road safety by alerting drivers of critical traffic information. Using NXP’s technology combined with application software from 6667 Cohda Wireless, Delphi’s platform allows alerts to be delivered to vehicles from other cars and surrounding infrastructure such as traffic lights and signage. This alerts drivers about potentially hazardous traffic situations even beyond the line of sight, optimally complementing Advanced Driver Assistance Systems (ADAS) like radar.

Messages could include blind-intersection collision, road condition hazards, road works, presence of emergency vehicles, stationary or slow moving vehicles, traffic jam and accident warnings, as well as traffic signals or signage indicators.

The solution avoids cellular or other networks that can be slow or unreliable. Instead operations on IEEE 802.11p, a wireless communication standard for the automotive industry, and directly connects surrounding infrastructure and vehicles to each other to achieve immediate transmission and ensure reliable road safety communications.

For more information on companies in this article

Related Content

  • NXP drives safe and secure mobility
    September 19, 2018
    NXP Semiconductors, the world's largest supplier of automotive semiconductor solutions, is once again demonstrating its latest innovations for enabling securely connected, self-driving cars here at this year’s ITS World Congress. Visitors to the company’s stand will experience the latest NXP solutions for the ITS market. A highlight of the showcase will be latest generation of its DSRC-based V2X solution. NXP says its RoadLink SAF5400 is the world's first automotive qualified, high-performance single-chip
  • Taking it to the streets
    November 30, 2012
    The University of Michigan Transportation Research Institute (UMTRI) and US Department of Transportation (USDOT) have launched the Connected Vehicle Safety Pilot Model Deployment in Ann Arbor, Michigan. The largest connected vehicle test undertaken, and a critical next step in the development of vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication. The pilot, a $22 million partnership between UMTRI and USDOT, is part of a joint research initiative led by the National Highway Traffic
  • Cohda launches V2X solution
    September 8, 2022
    MK6 will be 'catalyst' for increasing roll-out of connected vehicles, says manufacturer
  • Kapsch launches new V2X platform
    November 19, 2013
    Kapsch TrafficCom is expanding its V2X technology portfolio with the new EVK-3300 communications platform for V2X communication, which it is introducing at the Car 2 Car Communication Consortium Forum in Munich. With its EVK-3300 platform Kapsch is directly targeting car manufacturers and suppliers with the EVK-3300, which it says is an essential part of V2X, the communication between vehicles and infrastructure and between vehicles themselves. The platform can be integrated into vehicles in various