Skip to main content

Kontron introduces next generation of IoT ready modular devices

Embedded computing technologies specialist Kontron has introduced its new COM Express computer-on-module Kontron COMe-cBL6 and the mini motherboard mITX-BDU-U. Both are IoT-ready and equipped with fifth generation Intel Core SoC processors as well as Intel Celeron processors.
May 6, 2015 Read time: 1 min

Embedded computing technologies specialist 8087 Kontron has introduced its new COM Express computer-on-module Kontron COMe-cBL6 and the mini motherboard mITX-BDU-U. Both are IoT-ready and equipped with fifth generation Intel Core SoC processors as well as Intel Celeron processors.

Kontron says both devices are suitable for environments that require multi-touch display systems or maximising limited power consumption, including surveillance and security systems, digital signage, industrial tablet PCs for logistics, retail or production markets and human-machine interfaces used in automation or medical image processing.

The COMe-cBL6 with pin-out type 6 is highly scalable and covers a wide area of requirements utilising Intel Core i7 processors to Intel Celeron processors and supports Microsoft Windows 8.1u and 7, WEI8.1, WES7 as well as Linux and VxWorks. The ultra-thin profiled mini motherboard mITX is an embedded, low powered motherboard with Intel fifth generation 14nm Core processors i7, i5, and i3 and provides a low powered platform with 15W CPUs in a 23mm envelope. The device mITX supports Windows 7, Windows 8.1 and Linux operating systems.

For more information on companies in this article

Related Content

  • MapLink 7.0 from Envitia
    March 20, 2012
    Envitia is launching the next generation of MapLink Pro featuring over 400 enhancements to both the Windows and Linux platforms to provide high performance and flexible components for demanding geospatial systems. The latest issue takes advantage of modern 64-bit hardware and utilises multi-threading to boost performance by up to 60%.
  • ITS America publishes connected vehicle guidance
    April 22, 2015
    Guidance on the likely impact of multipath communications on connected vehicle development has been published by ITS America. ITS America’s Connected Vehicle Technical Insight looks at the challenges and opportunities wireless interoperability could provide in vehicle applications. In particular the 22-page document examines the processes by which data can be transferred from one vehicle to another (V2V), or between a vehicle and the infrastructure (V2I).
  • Teledyne e2v’s Emerald 2 sensor for machine vision applications
    October 25, 2018
    Teledyne e2v says its Emerald 2M sensor helps to lower the cost of a full HD camera system as it is compatible with low-cost 1/3” optics. The CMOS image sensor is optimised for machine vision applications and includes 5° chief ray angle compensation, the company adds. According to Teledyne, Emerald 2M’s global shutter and MIPI CSI-2 interface allow it to utilise image signal processors available for mobile applications. The sensor comes with digital functionalities such as multi region of interest, subs
  • Intertraffic Awards 2022: shortlist announced!
    February 4, 2022
    Winners will be revealed at the opening ceremony of Intertraffic Amsterdam in March