Skip to main content

ITS European Congress 2020: call for contributions

Ertico – ITS Europe is calling for contributions to the ITS European Congress taking place in Lisbon next year. Authors of papers and organisers of proposed sessions will be asked during the online submission process to explain how their contribution aids sustainability and reflects the Congress’ overall theme of ITS: The Game Changer. The Portuguese capital has been chosen as European Green Capital for 2020. In a new development, the category Commercial Papers has been replaced by Business Presentations,
October 17, 2019 Read time: 1 min

374 Ertico – ITS Europe is calling for%$Linker: 2 External <?xml version="1.0" encoding="utf-16"?><dictionary /> 0 0 0 link-external contributions false https://itseuropeancongress.com/submissions/?utm_source=ITS+Congress&amp;utm_campaign=6ff0e8956a-EMAIL_CAMPAIGN_2019_10_04_12_02&amp;utm_medium=email&amp;utm_term=0_2ce6f247ce-6ff0e8956a-304607861 false false%>to the ITS European Congress taking place in Lisbon next year.

Authors of papers and organisers of proposed sessions will be asked during the online submission process to explain how their contribution aids sustainability and reflects the Congress’ overall theme of ITS: The Game Changer. The Portuguese capital has been chosen as European Green Capital for 2020.

In a new development, the category Commercial Papers has been replaced by Business Presentations, which describe a service aimed at generating or improving a specific product, device or idea.

Special Interest Sessions are now called Proposed Sessions.

ITS European Congress 2020 runs in Lisbon from 18-20 May 2020.

The deadline for papers and proposed sessions is 16 December.

For more information on companies in this article

Related Content

  • Intercomp launches LS-WiM system for fleet operators
    April 17, 2019
    Intercomp has launched a low-speed Weigh in Motion (LS-WiM) system which it says allows fleet managers to collect the weight of vehicles without hampering traffic flow. The system is suitable for high-volume entry and exit gates and, unlike full-length truck scales, does not require incoming and outgoing traffic to stop every time a vehicle needs to be weighed, the company adds. According to Intercomp, the system’s small footprint allows it to be installed at most facilities at approximately half
  • Parsons accepting entries for smart city challenge
    August 28, 2019
    Engineering firm Parsons and its partners have launched a global smart cities challenge called Transforming Intersections aimed at reducing the time drivers spend at red lights. Chuck Harrington, chairman of Parsons, says: “Our goal is to give cities the opportunity to increase their mobility, reduce their carbon footprint through reduced idling of vehicles, and keep their city moving." Parsons says the winner will receive a one-year free trial of its Intelligent Intersection product, which allows ci
  • Eco-AT: Release 1 of C-ITS system specifications
    December 17, 2014
    The ECo-AT (European Corridor – Austrian Testbed for Cooperative Systems) is the Austrian part of the Cooperative ITS corridor crossing Germany, Netherlands and Austria. It aims to specify and implement harmonised and standardised cooperative ITS applications. The related system specifications documents will be developed in four releases and the first release is available now. It comprises: Explanatory note to Release 1 documents Use case Overview Document Use case Road Works Warning (RWW) Document
  • Patented card lamination technology
    November 20, 2013
    Melzer’s inline systems for the manufacture of MRTD products like eNID cards or driving licences, border crossing documents or ePassports laminate for only 20-30s at 180-200C. This patented technology ensures a gentle lamination of the electronics (RFID inlays) and other security features like special ink, security thread and so on. The modular design and customized solutions are further advantages. Additionally Melzer offers revolutionary inlay production solutions for ID cards and passports based on pla