Skip to main content

Hyundai and Aurora partner to develop Level 4 AVs by 2021

Aurora’s self-driving technology will be incorporated into Hyundai Motor’s (Hyundai) vehicles in an agreement to bring Level 4 autonomy to market by 2021. The partnership aims to deploy autonomous driving quickly, broadly and safely with Hyundai’s new generation fuel-cell vehicle to be the first test model this year. In the long term, both companies will work to commercialize these vehicles worldwide. The project will initially focus on the ongoing development of hardware and software for automated and
January 5, 2018 Read time: 2 mins

Aurora’s self-driving technology will be incorporated into Hyundai Motor’s (Hyundai) vehicles in an agreement to bring Level 4 autonomy to market by 2021. The partnership aims to deploy autonomous driving quickly, broadly and safely with Hyundai’s new generation fuel-cell vehicle to be the first test model this year. In the long term, both companies will work to commercialize these vehicles worldwide.

The project will initially focus on the ongoing development of hardware and software for automated and autonomous driving and the back-end data services required for vehicles to operate without human input or oversight under select conditions.

Hyundai’s fuel-cell vehicle will make its global debut next week at this year’s Consumer Electronics show 2018, in Las Vegas.

Dr. Woong Chul Yang, Vice Chairman of Hyundai Motor, said: "We know the future of transportation is autonomous, and autonomous driving technology needs to be proven in the real-world to accelerate deployment in a safe and scalable manner. Combining our advanced vehicle technology that embeds the latest safety features with Aurora's leading suite of Level 4 autonomous technology will advance this revolution in mobility with Hyundai in a leadership position."

More information is available on the %$Linker: 2 External <?xml version="1.0" encoding="utf-16"?><dictionary /> 0 0 0 link-external website Hyundai Press Office website link false https://www.hyundaipressoffice.co.uk/release/913/ false false%>.

Related Content

  • ITF annual transport summit
    May 8, 2015
    The Annual Summit of the International Transport Forum (ITF) provides a platform for global discussion on strategies for transport in the 21st century. Since 2008, the Annual Summit has developed into the leading global get-together of the key players in transport and transport-related sectors, providing a unique platform for high-level exchange on strategic policy issues. The theme of the 2015 Summit is Transport, Trade and Tourism. It takes place in Leipzig, Germany from 27-29 May 2015, under the presi
  • C/AV planning turns to business cases, says DfT
    July 9, 2019
    Darren Capes, DfT ITS lead, said projects are working on the business case to understand the benefits of C/AV technologies and what the issues may be. He was speaking at the ITS (UK) Connected Vehicle Forum in Birmingham, where Zenzic - an organisation created by the UK government to accelerate self-driving technology - explained its roadmap to 2030 implementation, summarising co-ordination efforts and project management. If efforts are not coordinated, it may take another 50 years for the technolog
  • ITS America announces call for participation for 23rd annual meeting & exposition in Nashville
    September 20, 2012
    The Intelligent Transportation Society of America (ITS America) has issued its call for papers and presentations for consideration for its 23rd Annual Meeting & Exposition, to be held at the Gaylord Opryland Resort and Convention Center in Nashville, Tennessee from April 22-24, 2013. ITS America is looking for high quality contributions to the technical program; content selected will further the discussion about state-of-the-art transportation technologies or offer a fresh outlook on the policy, financial,
  • Patented card lamination technology
    November 20, 2013
    Melzer’s inline systems for the manufacture of MRTD products like eNID cards or driving licences, border crossing documents or ePassports laminate for only 20-30s at 180-200C. This patented technology ensures a gentle lamination of the electronics (RFID inlays) and other security features like special ink, security thread and so on. The modular design and customized solutions are further advantages. Additionally Melzer offers revolutionary inlay production solutions for ID cards and passports based on pla